Detail information of Solyc11g013530.1_circ_g.1


General Information
CircRNA Name Solyc11g013530.1_circ_g.1
ID in PlantcircBase sly_circ_003306
Alias SL3.0ch11:6613322|6614002
Organism Solanum lycopersicum
Position chr11: 6613039-6613719  JBrowse»
Reference genome SL2.50.38
Type   ei-circRNA
Identification method CIRI; find_circ
Parent gene Solyc11g013530.1
Parent gene annotation protein_coding
Parent gene strand +
Alternative splicing Solyc11g013530.1_circ_g.2 Solyc11g013530.1_circ_g.3 Solyc11g013530.1_circ_g.4
Support reads NA
Tissues leaf
Exon boundary   No-Yes
Splicing signals   GT-TA
Number of exons covered Solyc11g013530.1.1:2
Experimental Information
Sanger sequencing for BSS   NA
PCR primers for BSS    NA
Sanger sequencing for FL    NA
PCR primers for FL    NA
Sequences
Splice junction sequence   AGAATACGGTGTTCCACAGCAGCCTATTAATAGGGACTTGTGTGAAAATAAAGATGGTGATGTG
GCTGATCCTGTAGATTTCACCATGATATTGAAAAAGggagcttgtaggacatctttccatccta
tatgtgccagggaagcaagccacagaatggagatatggggcaaacttggatgtgatgatgtgag
ctcttgtt
Assembled circRNA sequence   NA
Full-length trsnacripts NA
Genomic sequence GGAGCTTGTAGGACATCTTTCCATCCTATATGTGCCAGGGAAGCAAGCCACAGAATGGAGATAT
GGGGCAAACTTGGATGTGATGATGTGAGCTCTTGTTTTCTGTTTTTTAAAATTCTTGTTCTTCC
TGTCGTGGTTCTTTTTATCTGTAATATTGAACTGATAATCCTTTTCTGATTTCGGTTTTCGAGT
TGATGTTATTTTATACTAAGTGTACTTTGATCCTCCCTTTTGTAAAATCATGTTGATTTAAAGT
GTCTTCCTTGTTACTCTTTACCTACTTATTTCCAATGCTTTTAGGTTGAATTACGTGCATTCTG
CTCGAAGCATTCAGATTTCCAGATCAGCAGTAGCAGTCAACAAGGTAAAGGATCTGCAGTAGAC
GTTTCTTGCTCCACAGATAACAATCAGTTGGCTGGGTCAGTCACAGCCAAATCACACAAGTTAA
AGCTTGGCTTAAGAAATGGAGACAAAATGGTGTTGCACACGGACAGTTCCAGTTCAGGTTTAGA
TAAGTTGAATGATGATGGATTACAACAGGAAGGGCTGCTGGAGAAGGGCTTGAATCTTAGACAC
CAAACAGAATACGGTGTTCCACAGCAGCCTATTAATAGGGACTTGTGTGAAAATAAAGATGGTG
ATGTGGCTGATCCTGTAGATTTCACCATGATATTGAAAAAG
Conservation Information
Conserved circRNAs NA
PMCS 0.199596929
Functional Information
Coding potential N
Potential coding position NA
Potential amino acid sequence NA
Sponge-miRNAs NA
circRNA-miRNA-mRNA network  VISUALIZATION
Potential function description responsive to low-temperature stress
Other Information
References Yang et al., 2020