Detail information of AT4G25940_circ_g.5


General Information
CircRNA Name AT4G25940_circ_g.5
ID in PlantcircBase ath_circ_032840
Alias AT4G25940_C1
Organism Arabidpsis thaliana
Position chr4: 13171820-13172182  JBrowse»
Reference genome TAIR10.38
Type   e-circRNA
Identification method CIRCexplorer, CIRI2
Parent gene AT4G25940
Parent gene annotation Putative clathrin assembly protein At4g25940
Parent gene strand -
Alternative splicing AT4G25940_circ_g.4
Support reads 7
Tissues seedlings, leaf
Exon boundary   Yes-Yes
Splicing signals   CT-AC
Number of exons covered AT4G25940.1:2
Experimental Information
Sanger sequencing for BSS   NA
PCR primers for BSS    NA
Sanger sequencing for FL    NA
PCR primers for FL    NA
Sequences
Splice junction sequence   GTATATGTCCTCTATGTGAGTAATTGAGAAGCTCTTCTCTAAATGTTGGATCACCTTCTCTTAG
TGTTCTATGAATGACTATTAACACCTTGATCGCAACctttgaagatgcacctgaaccttttggt
aaacgttctgcttctatgtcatacttcaaaacccgatagcattcaagccgctcctcgaggaaaa
gcgcgtat
Assembled circRNA sequence   Yes
Full-length trsnacripts Transcript length: 267
Transcript exons: 13171820-13171947,13172044-13172182
CTTTGAAGATGCACCTGAACCTTTTGGTAAACGTTCTGCTTCTATGTCATACTTCAAAACCCGA
TAGCATTCAAGCCGCTCCTCGAGGAAAAGCGCGTATGTCCTAATCCACGCAGAGCAATCCCAAG
CAAGAGGACTTGTATCGTCTTTGAAGTTTGATATTCGAAGTATATGTCCTCTATGTGAGTAATT
GAGAAGCTCTTCTCTAAATGTTGGATCACCTTCTCTTAGTGTTCTATGAATGACTATTAACACC
TTGATCGCAAC

Genomic sequence CTTTGAAGATGCACCTGAACCTTTTGGTAAACGTTCTGCTTCTATGTCATACTTCAAAACCCGA
TAGCATTCAAGCCGCTCCTCGAGGAAAAGCGCGTATGTCCTAATCCACGCAGAGCAATCCCAAG
CTGCAACAAACAAGTCAATACAAGAAAATGTTTTAAAACAATTTTCATTAACACATAAAAAGCT
ATGTAACAAAGGATATATAATAGGCTATTTACCAAGAGGACTTGTATCGTCTTTGAAGTTTGAT
ATTCGAAGTATATGTCCTCTATGTGAGTAATTGAGAAGCTCTTCTCTAAATGTTGGATCACCTT
CTCTTAGTGTTCTATGAATGACTATTAACACCTTGATCGCAAC
Conservation Information
Conserved circRNAs NA
PMCS 0.283280181
Functional Information
Coding potential N
Potential coding position NA
Potential amino acid sequence NA
Sponge-miRNAs NA
circRNA-miRNA-mRNA network  VISUALIZATION
Potential function description response to drought stress; responsive to heat stress
Other Information
References Pan et al., 2017;Zhang et al., 2019